Lodalva 0.75Cu 99.25 Sn 50%
• 0.8 mm lead-free solder ideal for use on micro-electronics, fine wires and most of other electrical and electronic soldering applications
• Tin - lead has a melting point of 217 °C
• The tin - silver - copper solder provides a lower melting point of 207 °C and a low-resistance solder joint
• Designed for the most demanding jobs where precision is of the utmost importance
• Tin - lead has a melting point of 217 °C
• The tin - silver - copper solder provides a lower melting point of 207 °C and a low-resistance solder joint
• Designed for the most demanding jobs where precision is of the utmost importance
| ABC klase | C - Pēc pasūtījuma |
| Zīmols | Bahco |
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